| contributor author | William J. Marsh | |
| contributor author | Issam Mudawar | |
| date accessioned | 2017-05-08T23:29:46Z | |
| date available | 2017-05-08T23:29:46Z | |
| date copyright | March, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26106#46_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105273 | |
| description abstract | Controlling boiling incipience is of paramount importance for reliable operation of liquid-cooled microelectronic heat sources during power transients. This study focuses on heat transfer from a simulated multichip module to a falling film. Experiments have been performed to develop an understanding of the influence of surface tension and wetting characteristics on sensible heat transfer and boiling incipience in free-falling dielectric (FC-72) liquid films. The boiling results reveal that the vanishingly small contact angle of FC-72 precludes the application of correlations currently employed to predict incipience. Also, the temperature excursion commonly encountered upon boiling incipience in wetting fluids was nonexistent in all the experimental runs. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Sensible Heating and Boiling Incipience in Free-Falling Dielectric Liquid Films | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226508 | |
| journal fristpage | 46 | |
| journal lastpage | 53 | |
| identifier eissn | 1043-7398 | |
| keywords | Boiling | |
| keywords | Dielectric liquids | |
| keywords | Heating | |
| keywords | Heat transfer | |
| keywords | Wetting (Surface science) | |
| keywords | Fluids | |
| keywords | Surface tension | |
| keywords | Heat | |
| keywords | Temperature | |
| keywords | Multi-chip modules AND Liquid films | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001 | |
| contenttype | Fulltext | |
