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contributor authorK. L. De Weese
contributor authorC. K. H. Dharan
contributor authorC. E. Toups
date accessioned2017-05-08T23:29:46Z
date available2017-05-08T23:29:46Z
date copyrightMarch, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26106#21_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105269
description abstractSignificant stresses are induced in brazed metal-to-ceramic joints during cool-down. Analysis of such stresses is complicated by nonlinear material behavior and uncertainties in material properties at and near the braze temperatures. In this study, stresses induced during cool-down from the brazing temperature are analytically determined for a coaxial RF (radio frequency) window, which is an integral component of many traveling-wave tube (TWT) devices. The approach is to use nonlinear finite element analysis which takes into account plastic deformation of the metal components as well as the temperature dependence of material properties. Details of the modeling techniques, analytical assumptions and boundary conditions employed are discussed. In addition, metallographic analysis of the brazed test assemblies is described. Analytically predicted stress distributions showed reasonably good correlation with both the location and direction of cracks observed in the ceramic component of brazed sample test assemblies. The results of this investigation emphasize the need for accurate material properties for the braze alloys used in such joints, including temperature dependence, as well as an understanding of their nonlinear behavior, for the stress analysis model to be accurate. In addition, the important role of joint geometry in the minimization of cool-down stresses in brazed metal-ceramic assemblies is described.
publisherThe American Society of Mechanical Engineers (ASME)
titleAnalysis of Brazing Stresses in Ceramic-Metal Joints in High-Vacuum Devices
typeJournal Paper
journal volume111
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226503
journal fristpage21
journal lastpage25
identifier eissn1043-7398
keywordsCeramics
keywordsVacuum
keywordsStress
keywordsBrazing
keywordsMetals
keywordsTemperature
keywordsMaterials properties
keywordsFinite element analysis
keywordsModeling
keywordsBoundary-value problems
keywordsGeometry
keywordsTravel
keywordsDeformation
keywordsAlloys
keywordsMetalwork
keywordsIndustrial ceramics
keywordsWaves
keywordsStress analysis (Engineering) AND Fracture (Materials)
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001
contenttypeFulltext


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