| contributor author | J. H. Lau | |
| date accessioned | 2017-05-08T23:29:45Z | |
| date available | 2017-05-08T23:29:45Z | |
| date copyright | March, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26106#2_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105265 | |
| description abstract | An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed stress and strain distributions and whole-field displacements of the assembly are also provided for a better understanding of its mechanical behavior during thermal cycling. It was found that the stresses and strains in the PQFP solder joint are smaller than those in the plastic-leaded-chip-carrier (PLCC) solder joint. The results presented herein should be useful in the design for reliability of this class of surface mount assemblies. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Stress Analysis of SMT PQFP Packages and Interconnections | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226505 | |
| journal fristpage | 2 | |
| journal lastpage | 8 | |
| identifier eissn | 1043-7398 | |
| keywords | Thermal stresses | |
| keywords | Manufacturing | |
| keywords | Solder joints | |
| keywords | Stress | |
| keywords | Surface mount assemblies | |
| keywords | Reliability | |
| keywords | Finite element methods | |
| keywords | Design AND Mechanical behavior | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001 | |
| contenttype | Fulltext | |
