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contributor authorY. Joshi
contributor authorT. Willson
contributor authorS. J. Hazard
date accessioned2017-05-08T23:29:45Z
date available2017-05-08T23:29:45Z
date copyrightJune, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26108#121_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105259
description abstractAn experimental study of steady state and transient natural convection from a single column of eight heated, rectangular protrusions mounted on a vertical surface in water is presented. The component power dissipation levels were varied in the range 0.2–1.5 W using foil heaters attached to the base of each protrusion. Visualizations in three different vertical planes indicated a three-dimensional, laminar developing boundary region type flow structure away from the protrusions. Near the vertical surface, the fluid followed the protrusion boundaries with no evidence of vortex formation. Surface temperatures were measured at the centers of each of the five fluid exposed faces. Nondimensional heat transfer rates were calculated based on these measurements. Accounting for the increasing convected energy downstream resulted in a single correlation for all components and power levels. Temperature measurements in the adjacent fluid were made using a movable hypodermic probe. Transport evolution during the transient showed initially diffusive patterns, followed by rapid development of entrainment.
publisherThe American Society of Mechanical Engineers (ASME)
titleAn Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water
typeJournal Paper
journal volume111
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226516
journal fristpage121
journal lastpage128
identifier eissn1043-7398
keywordsNatural convection
keywordsWater
keywordsFluids
keywordsMeasurement
keywordsTemperature measurement
keywordsEnergy dissipation
keywordsVisualization
keywordsVortices
keywordsProbes
keywordsSteady state
keywordsFlow (Dynamics)
keywordsTemperature AND Heat transfer
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
contenttypeFulltext


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