| contributor author | Avram Bar-Cohen | |
| contributor author | editor | |
| contributor author | Peter A. Engel | |
| contributor author | Allan D. Kraus | |
| contributor author | editor | |
| date accessioned | 2017-05-08T23:29:44Z | |
| date available | 2017-05-08T23:29:44Z | |
| date copyright | June, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26108#162_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105249 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1 | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226523 | |
| journal fristpage | 162 | |
| identifier eissn | 1043-7398 | |
| keywords | Electronic components AND Modeling | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
| contenttype | Fulltext | |
