Microelectronics Packaging Handbook
| contributor author | Rao R. Tummala | |
| contributor author | editor | |
| contributor author | Y. C. Lee | |
| contributor author | Eugene J. Rymaszewski | |
| contributor author | editor | |
| date accessioned | 2017-05-08T23:29:42Z | |
| date available | 2017-05-08T23:29:42Z | |
| date copyright | September, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26110#241_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105235 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Microelectronics Packaging Handbook | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226540 | |
| journal fristpage | 241 | |
| journal lastpage | 242 | |
| identifier eissn | 1043-7398 | |
| keywords | Microelectronic packaging | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003 | |
| contenttype | Fulltext |
