| contributor author | E. Suhir | |
| date accessioned | 2017-05-08T23:29:40Z | |
| date available | 2017-05-08T23:29:40Z | |
| date copyright | December, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26113#277_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105226 | |
| description abstract | In this analysis we suggest a simple engineering method for the evaluation of the interfacial stresses in elongated bimaterial plates subjected to bending. The taken approach enables one to satisfy the boundary conditions at the plate’s ends within the framework of the elementary beam, or long-and-narrow plate, theory. The analysis is carried out in application to bending on a circular mandrel, which is regarded by many reliability engineers as a suitable test vehicle for the evaluation of the mechanical performance of the attachment material in adhesively bonded and soldered assemblies in electronic packaging. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Calculated Interfacial Stresses in Elongated Bimaterial Plates Subjected to Bending | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226547 | |
| journal fristpage | 277 | |
| journal lastpage | 281 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress | |
| keywords | Plates (structures) | |
| keywords | Vehicles | |
| keywords | Boundary-value problems | |
| keywords | Equipment performance | |
| keywords | Engineers | |
| keywords | Reliability AND Electronic packaging | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004 | |
| contenttype | Fulltext | |
