Abstract: In the automotive and computer industries, a perennial challenge has been to design an adequate and efficient accelerated thermal cycling test which would correspond to field service conditions. ...

Abstract: When an electronic package is subjected to thermal cycling, the solder joint interconnects are subjected to a complex stress system. If the stress is sufficiently large, the solder joint will ...

Abstract: A relatively simple numerical method was developed to determine the stress intensity factors of interfacial cracks in bimaterial systems. The method is based on the evaluation of crack tip ...

Abstract: A linear-elastic analytical model has been developed to describe the deformed geometry of a multi-layered stack assembly subject to thermal loading. The model is based on Timoshenko’s bimetal ...

Abstract: This paper concerns a repetitive-control system with an input-dead-zone (IDZ) nonlinearity. First, the expression for the IDZ is decomposed into a linear term and a disturbance-like one that depends on the parameters of ...

Abstract: Long-term reliability of electronic packaging has become a greater challenge as a result of ever increasing power requirements and the decreasing size of electronic packages. In this study, the ...

Abstract: In this study, metal particles were added during the spot friction welding (SFW) process, a solid state sheet metal joining process, to create a localized metal matrix composite (MMC) for the ...

Abstract: The maximum interface sheer stress and crack density can be used as criteria for the interfacial bonding property and fracture performance, respectively. In this paper, interface stress and crack density as a function of ...

Abstract: The interface shear-resistant construction method between ultrahigh-performance concrete (UHPC) and normal concrete (NC) is critical to ensuring the overall collaborative work performance and structural safety of steel-UHPC-NC ...