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RISReduced Order Thermal Models of Multiscale Microsystems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal systems often involve multiple spatial and temporal scales, where transport information from one scale is relevant at others. Optimized thermal design of such systems and their control ...
Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance ...
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel heat sink based on a multilayer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a ...
Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Liquid cooling with phase change has been demonstrated to be a very efficient technique for thermal management of electronics because it has the potential to achieve high heat transfer coefficients ...
Application of Thermoelectric-Adsorption Cooler for Harsh Environment Electronics Under Varying Heat Load
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Incorporation of a thermoelectric (TE) device for heat regeneration and recovery can help realize adsorption systems that would be compact enough to fit inside electronic enclosures. Such a ...
Proper Orthogonal Decomposition for Reduced Order Thermal Modeling of Air Cooled Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Computational fluid dynamics/heat transfer (CFD/HT) methods are too time consuming and costly to examine the effect of multiple design variables on the system thermal performance, especially for ...
Thermal Issues in Emerging Technologies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This special issue of the Journal of Heat Transfer contains six papers selected out of the 53 presented at the Second International Conference on Thermal Issues in Emerging Technologies, Theory ...
Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper is centered on quantifying the effect of computer room and computer room air conditioning (CRAC) unit modeling on the perforated tile flow distribution in a representative raised-floor ...
The Thermal Design of a Next Generation Data Center: A Conceptual Exposition
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the near future, electronic cabinets of data centers will house high performance chips with heat fluxes approaching 100 W/cm2 and associated high volumetric heat generation rates. With the ...
Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the promising liquid cooling techniques for microelectronics is attaching a microchannel heat sink to, or directly fabricating microchannels on, the inactive side of the chip. A stacked ...