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    Thermal Issues in Emerging Technologies

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 006::page 60301
    Author:
    Yogendra Joshi
    ,
    Mohamed-Nabil Sabry
    DOI: 10.1115/1.4003447
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This special issue of the Journal of Heat Transfer contains six papers selected out of the 53 presented at the Second International Conference on Thermal Issues in Emerging Technologies, Theory and Applications (ThETA2) held in Cairo, Egypt in December 17–20, 2008. Emerging technologies in various domains, including microelectronics, nanoscience and engineering, smart materials, microelectromechanical systems, biomedical engineering, and novel energy conversion approaches present many challenging and interesting thermal effects and interactions. In many applications, such effects become a dominant factor in determining the overall performance or response. ThETA2 theme topics included micro- and nanoscale heat transfer, modeling of multiscale heat transfer problems, thermal modeling of electronic systems, temperature aware computer systems design, cooling of electronic systems and data centers, compact thermal models, thermomechanical effects, MEMS—multiphysics problems, new and renewable energies, solid-state energy generation/cooling, fuel cells, energy conservation, energy—buildings—environment, multiphase flow with heat transfer, thermal issues in biomedical engineering, thermal issues in microfabrication technology, thermal issues in new materials, computational methods in heat transfer, and advanced experimental methods in heat transfer.
    keyword(s): Flow (Dynamics) , Temperature , Heat transfer , Cooling , Foams (Chemistry) , Aluminum , Structures , Particulate matter , Air flow , Advanced materials , Simulation , Smart materials , Biomedical engineering , Multiphase flow , Temperature effects , Microelectromechanical systems , Energy conversion , Design , Energy conservation , Energy generation , Experimental methods , Fuel cells , Microscale devices , Modeling , Nanoscale heat transfer , Nanoscience , Refrigeration , Computers , Data centers , Diesel , Electronic systems , Filters , Graphite , Heat sinks , Microfabrication , Microelectronic devices , Heat transfer coefficients AND Computational methods ,
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      Thermal Issues in Emerging Technologies

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    http://yetl.yabesh.ir/yetl1/handle/yetl/146672
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    contributor authorYogendra Joshi
    contributor authorMohamed-Nabil Sabry
    date accessioned2017-05-09T00:45:01Z
    date available2017-05-09T00:45:01Z
    date copyrightJune, 2011
    date issued2011
    identifier issn0022-1481
    identifier otherJHTRAO-27915#060301_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/146672
    description abstractThis special issue of the Journal of Heat Transfer contains six papers selected out of the 53 presented at the Second International Conference on Thermal Issues in Emerging Technologies, Theory and Applications (ThETA2) held in Cairo, Egypt in December 17–20, 2008. Emerging technologies in various domains, including microelectronics, nanoscience and engineering, smart materials, microelectromechanical systems, biomedical engineering, and novel energy conversion approaches present many challenging and interesting thermal effects and interactions. In many applications, such effects become a dominant factor in determining the overall performance or response. ThETA2 theme topics included micro- and nanoscale heat transfer, modeling of multiscale heat transfer problems, thermal modeling of electronic systems, temperature aware computer systems design, cooling of electronic systems and data centers, compact thermal models, thermomechanical effects, MEMS—multiphysics problems, new and renewable energies, solid-state energy generation/cooling, fuel cells, energy conservation, energy—buildings—environment, multiphase flow with heat transfer, thermal issues in biomedical engineering, thermal issues in microfabrication technology, thermal issues in new materials, computational methods in heat transfer, and advanced experimental methods in heat transfer.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Issues in Emerging Technologies
    typeJournal Paper
    journal volume133
    journal issue6
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4003447
    journal fristpage60301
    identifier eissn1528-8943
    keywordsFlow (Dynamics)
    keywordsTemperature
    keywordsHeat transfer
    keywordsCooling
    keywordsFoams (Chemistry)
    keywordsAluminum
    keywordsStructures
    keywordsParticulate matter
    keywordsAir flow
    keywordsAdvanced materials
    keywordsSimulation
    keywordsSmart materials
    keywordsBiomedical engineering
    keywordsMultiphase flow
    keywordsTemperature effects
    keywordsMicroelectromechanical systems
    keywordsEnergy conversion
    keywordsDesign
    keywordsEnergy conservation
    keywordsEnergy generation
    keywordsExperimental methods
    keywordsFuel cells
    keywordsMicroscale devices
    keywordsModeling
    keywordsNanoscale heat transfer
    keywordsNanoscience
    keywordsRefrigeration
    keywordsComputers
    keywordsData centers
    keywordsDiesel
    keywordsElectronic systems
    keywordsFilters
    keywordsGraphite
    keywordsHeat sinks
    keywordsMicrofabrication
    keywordsMicroelectronic devices
    keywordsHeat transfer coefficients AND Computational methods
    treeJournal of Heat Transfer:;2011:;volume( 133 ):;issue: 006
    contenttypeFulltext
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