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    Quantum Dots Converted Light Emitting Diodes Packaging for Lighting and Display: Status and Perspectives 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002:;page 20803
    Author(s): Xie, Bin; Hu, Run; Luo, Xiaobing
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Recent years, semiconductor quantum dots (QDs) have attracted tremendous attentions for their unique characteristics for solidstate lighting (SSL) and thinfilm display applications. The pure and tunable spectra of QDs make ...
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    Analysis of Bus Speed Using a Multivariate Conditional Autoregressive Model: Contributing Factors and Spatiotemporal Correlation 

    Source: Journal of Transportation Engineering, Part A: Systems:;2019:;Volume ( 145 ):;issue: 004
    Author(s): Haipeng Cui; Kun Xie; Bin Hu; Hangfei Lin; Rui Zhang
    Publisher: American Society of Civil Engineers
    Abstract: Bus speed indicates the performance of bus systems. Exploring the impact of contributing factors to bus speed can provide public transit agencies insights into developing improvement strategies. Bus speed observations can ...
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    Numerical and Experimental Study on the Transferred Volume in Phosphor Dip Transfer Coating Process of Light Emitting Diodes Packaging 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002:;page 21003
    Author(s): Shang, Bofeng; Yu, Xingjian; Zheng, Huai; Xie, Bin; Chen, Qi; Luo, Xiaobing
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The phosphor diptransfer coating method is simple and flexible for transferring a preanalyzed volume of phosphor gel, which can be beneficial to the high angular color uniformity (ACU) of white lightemitting diodes (LEDs). ...
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    Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 31005
    Author(s): Yu, Xingjian; Hu, Run; Wu, Ruikang; Xie, Bin; Zhang, Xiaoyu; Luo, Xiaobing
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...
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    Use of a Waste-Based Binder for High Water Content Soil Treatment 

    Source: Journal of Materials in Civil Engineering:;2018:;Volume ( 030 ):;issue: 008
    Author(s): Lam Kok Pang;Kou Hai lei;Xie Bin;Chu Jian;He Jia
    Publisher: American Society of Civil Engineers
    Abstract: In recent years, roads in Singapore have had to be constructed on reclaimed land using marine clay as fill materials. Improving the engineering properties of the high water content, soft clayey soil in the reclaimed land ...
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    Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 31001
    Author(s): Xie, Bin; Liu, Haochen; Sun, Xiao Wei; Yu, Xingjian; Wu, Ruikang; Wang, Kai; Luo, Xiaobing
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ...
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    Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 31001
    Author(s): Xie, Bin; Liu, Haochen; Sun, Xiao Wei; Yu, Xingjian; Wu, Ruikang; Wang, Kai; Luo, Xiaobing
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ...
    Request PDF

    Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 31005
    Author(s): Yu, Xingjian; Hu, Run; Wu, Ruikang; Xie, Bin; Zhang, Xiaoyu; Luo, Xiaobing
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian