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    Experimental and 3D Finite Element Studies of CW Laser Forming of Thin Stainless Steel Sheets 

    Source: Journal of Manufacturing Science and Engineering:;2001:;volume( 123 ):;issue: 001:;page 66
    Author(s): Guofei Chen; Xianfan Xu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Laser forming as a springback-free and noncontact forming technique has been under active investigation over the last decade. Previous investigations are mainly focused on forming of large and ...
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    Finite Element Analysis of Pulsed Laser Bending: The Effect of Melting and Solidification 

    Source: Journal of Applied Mechanics:;2004:;volume( 071 ):;issue: 003:;page 321
    Author(s): X. Richard Zhang; Xianfan Xu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This work developes a finite element model to compute thermal and thermomechanical phenomena during pulsed laser induced melting and solidification. The essential elements of the model are handling ...
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    High Precision Microscale Bending by Pulsed and CW Lasers 

    Source: Journal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 003:;page 512
    Author(s): X. Richard Zhang; Xianfan Xu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper discusses high precision microscale laser bending and the thermomechanical phenomena involved. The use of a pulsed and a CW laser for microscale bending of ceramics, silicon, and ...
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    Heat Transfer Across Metal-Dielectric Interfaces During Ultrafast-Laser Heating 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 004:;page 42402
    Author(s): Liang Guo; Stephen L. Hodson; Timothy S. Fisher; Xianfan Xu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Heat transfer across metal-dielectric interfaces involves transport of electrons and phonons accomplished either by coupling between phonons in metal and dielectric or by coupling between electrons ...
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    Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002:;page 20907
    Author(s): Stephen L. Hodson; Thiruvelu Bhuvana; Baratunde A. Cola; Xianfan Xu; G. U. Kulkarni; Timothy S. Fisher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which ...
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    Effects of Growth Temperature on Carbon Nanotube Array Thermal Interfaces 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 011:;page 114503
    Author(s): Baratunde A. Cola; Placidus B. Amama; Xianfan Xu; Timothy S. Fisher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Due to their excellent compliance and high thermal conductivity, dry carbon nanotube (CNT) array interfaces are promising candidates to address the thermal management needs of power dense ...
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