Abstract: Firstlevel and secondlevel compliant interconnect structures are being pursued in universities and industries to accommodate the differential displacement induced by the coefficient of thermal expansion mismatch between ...

Abstract: This paper presents a study on a dualpath compliant interconnect design which attempts to improve the balance between mechanical compliance and electrical parasitics by using multiple electrical paths in place of a single ...

Abstract: Wearable electronics undergo stretching, flexing, bending, and twisting during the process of being put on and while being worn. In addition, wearable textile electronics also need to survive under cyclic washing. During ...

Abstract: Flexible electronics are electronic devices and components that can be stretched, bent, twisted, and folded without losing their functionality. Flexible electronics is conformable, lightweight, easily tailorable, and ...

Abstract: Experimentally characterized critical interfacial fracture energy is often written as an explicit trigonometric function of mode-mixity and is used to determine whether an interfacial crack will propagate or not under given ...

Abstract: A method to determine the critical energy release rate of a peel tested sample using an energy-based approach within a finite element framework is developed. The method uses a single finite element model, in which the ...