Abstract: The plastic packaging process for integrated circuits is subject to several fabrication defects. For packages containing leadframes, three major defects may occur in the molding process alone, ...

Abstract: More wires in a package and smaller wire gaps are the trend in the integrated circuit (IC) packaging industry. The effect of wire density is becoming increasingly apparent, especially on the ...

Abstract: Warpage during integrated circuit encapsulation process is a serious problem. Previous researchers had focused on warpage analysis with thermal-induced shrinkage and the cure-induced shrinkage was ...

Abstract: Various methodologies of wire sweep analysis have been introduced to get better prediction and matching the experimental measurements by many researchers. As more and more high pin-count packages ...

Abstract: A two-plunger-type dilatometer was designed and fabricated to measure cure-induced volume changes of epoxy molding compound (EMC). The device is suitable for studying volume change of material ...

Abstract: This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing ...