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RISReview of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A number of models for thermomechanical stress analysis and fatigue failure of materials are reviewed and their capabilities and limitations are identified. The unified disturbed state concept ...
Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The disturbed state concept (DSC) with the hierarchical single surface (HISS) plasticity model have been proposed and validated previously for a wide range of problems in electronic packaging. ...
Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For realistic design, reliability and failure analysis of materials such as solders for problems in electronic packaging, it is essential to develop and validate appropriate constitutive models. ...
Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The compendium paper (Part 1: Models and Testing) presents details of the thermomechanical-digital image correction (TM-DIC) for testing of solders, test plan under variable temperature and strain ...