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Potential Failure Sites in a Flip-Chip Package With and Without Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global ...
Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended ...
Approach to Estimate Hydraulic Conductivity Function from Soil–Water Retention Curve for Noncohesive Soils
Publisher: ASCE
Abstract: Pavement materials are prone to damage due to mechanical loadings and rainfall infiltration. The rainfall initiates moisture movement within the layers and accelerates the damaging rate. A better understanding of the ...
Probabilistic Design Framework for Granular Filters
Publisher: ASCE
Abstract: A granular filter is required to satisfy two requirements of retention and hydraulic conductivity. The current design approaches are based on the representative grain sizes for retention and hydraulic conductivity requirements. ...
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