Abstract: In the electronic industry, the dominant failure mode for solder joints is assumed to be thermal cycling. When semiconductor devices are used in vibrating environment, such as automotive and ...

Abstract: Using the unified constitutive model and the finite element procedure presented in Part I (the preceding paper), a material nonlinear time domain dynamic analysis of a solder joint was studied ...

Abstract: Solder joints are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor ...