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RISConvective Heat Transfer Distribution on the Surface of an Electronic Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Measurements of the distribution of convective heat transfer over the five exposed faces of a low profile electronic package are described. The package, of square planform and length-to-height ...
A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A thermal response model for designing a hybrid thermal energy storage (TES) heat sink is developed. The stabilization time and maximum operating (hot side) temperature-to-transition temperature ...
Laminar-Transitional Convection From Repeated Ribs in a Channel
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Velocimetry, heat transfer, and pressure drop experiments are reported for laminar/transitional air flow in a channel containing rectangular transverse ribs located along one channel wall. The ...
A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two figures of merit for hybrid Thermal Energy Storage (TES) units are developed: the volumetric figure of merit, Ṽ, and the temperature control figure of merit, ΔT̃. A dimensional analysis ...
The Effect of Variations in Stream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of variations in stream-wise spacing and component length on convection from rectangular, surface mounted components in a channel flow are reported. Component dimensions are the same ...
Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heat transfer experiments are reported on the thermal performance of longitudinal fin heat sinks attached to an electronic package which is part of a regular array of packages undergoing forced ...
Experimental Modeling of Convection Downstream from an Electronic Package Row
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experiments on convective heat transfer in the wake of a row of closely spaced pin-mount packages are reported. Flow visualization and interferometric heat transfer measurements are made in an ...
Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The cooling performance of in-line and staggered regular arrays of simulated electronic packages is compared for both sparse and dense packaging configurations. At equal flow rates, staggered ...
Thermal Performance of Pin-Fin Fan-Sink Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experiments are reported on the thermal performance of model fan-sink assemblies consisting of a small axial flow fan which impinges air on a square array of pin-fins. Cylindrical, square, and ...
Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature ...