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RISShearing Deformation in Partial Areal Arrays: Analytical Results
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Simple, closed-form expressions, based on elasticity theory, are derived for determining the location and magnitude of the maximum shearing displacement in a partial areal array of solder joints. ...
Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is developed for the problem of a thermally loaded electronic assembly consisting of a nonhomogeneous component attached to a substrate by means of an areal array of solder ...
An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An improved time-dependent analytical model is developed for predicting the maximum shearing displacement in an area-array electronic assembly under global thermal mismatch loading. The thermal ...
Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical expression is derived for determining the maximum solder joint shearing displacement occurring in an a real-array interconnect under global CTE mismatch loading. The result may be ...
An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is developed for predicting the time-dependent shearing displacement in area-array solder interconnects due to global CTE mismatch under thermal cycling. As a first step toward ...
An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is developed and implemented to analyze the deformation of solder columns in column-grid-array(CGA) assemblies. Each solder column is modeled as a prismatic beam of circular ...
Enhanced Thermal Transport in Microchannel Using Oblique Fins
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to ...
Prediction of Solder Joint Geometries in Array-Type Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An approximate mathematical model is developed for predicting the shapes of solder joints in an array-type interconnect (e.g., a ball-grid array or flip-chip interconnect). The model is based ...
Solder Joint Formation in Surface Mount Technology—Part II: Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension ...
Effect of Chip and Pad Geometry on Solder Joint Formation in SMT
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model of solder joint formation during a surface mount reflow process is developed for two-dimensional fillets whose flow may be restricted due to “finite” metallizations on a ...