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    An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004::page 303
    Author:
    J. A. Swanson
    ,
    P. S. Lee
    ,
    S. M. Heinrich
    DOI: 10.1115/1.2793857
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An analytical model is developed and implemented to analyze the deformation of solder columns in column-grid-array(CGA) assemblies. Each solder column is modeled as a prismatic beam of circular cross section subjected to end shearing deflections caused by thermal mismatch between the module and the circuit board. The solder is idealized as an elastic-perfectly plastic material whose yielding is governed by the von Mises criterion. Since the columns are relatively short by beam standards, transverse shear deformation has been incorporated into the beam model. The results generated with the model indicate the following: 1. Yielding is governed by bending for slenderness ratios (height-to-diameter) of h/d ≥ 1/3. 2. The nonlinear stiffness relationship for a sheared column, presented in dimensionless form, reduces to a single curve, which is valid for arbitrary values of slenderness ratio (≥1/3) and material parameters. 3. The normalized relationship between maximum shear strain (in the Tresca sense) and the relative end deflection depends on Poisson’s ratio but is independent of the other material parameters and the slenderness ratio. The peak shear strain can easily be decomposed into elastic and plastic portions. 4. The maximum value of the total or the plastic shear strain in the solder column can be expressed in terms of a correction factor to be applied to the nominal shear strain (shear displacement divided by the column height). The correction factors are quite sensitive to the column slenderness and the load level. Since correction factors less than unity are possible, one should not interpret the nominal shear strain as the “average” shear strain in the column. Regardless of the load level, the nominal strain underestimates the peak strain by the greatest amount at a slenderness ratio (height/diameter) of 1.7. The nonlinear stiffness results presented in the paper may be used to create more efficient finite element models of entire assemblies by replacing each column with a single nonlinear spring element. When used in conjunction with an appropriate Coffin-Manson relationship, the maximum shear strain results presented herein may be utilized to increase column fatigue life.
    keyword(s): Solders , Shear (Mechanics) , Stress , Deflection , Stiffness , Plastics , Deformation , Displacement , Fatigue life , Finite element model , Shear deformation , Shearing , Springs , Poisson ratio AND Circuits ,
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      An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/121991
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    • Journal of Electronic Packaging

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    contributor authorJ. A. Swanson
    contributor authorP. S. Lee
    contributor authorS. M. Heinrich
    date accessioned2017-05-08T23:59:20Z
    date available2017-05-08T23:59:20Z
    date copyrightDecember, 1999
    date issued1999
    identifier issn1528-9044
    identifier otherJEPAE4-26175#303_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/121991
    description abstractAn analytical model is developed and implemented to analyze the deformation of solder columns in column-grid-array(CGA) assemblies. Each solder column is modeled as a prismatic beam of circular cross section subjected to end shearing deflections caused by thermal mismatch between the module and the circuit board. The solder is idealized as an elastic-perfectly plastic material whose yielding is governed by the von Mises criterion. Since the columns are relatively short by beam standards, transverse shear deformation has been incorporated into the beam model. The results generated with the model indicate the following: 1. Yielding is governed by bending for slenderness ratios (height-to-diameter) of h/d ≥ 1/3. 2. The nonlinear stiffness relationship for a sheared column, presented in dimensionless form, reduces to a single curve, which is valid for arbitrary values of slenderness ratio (≥1/3) and material parameters. 3. The normalized relationship between maximum shear strain (in the Tresca sense) and the relative end deflection depends on Poisson’s ratio but is independent of the other material parameters and the slenderness ratio. The peak shear strain can easily be decomposed into elastic and plastic portions. 4. The maximum value of the total or the plastic shear strain in the solder column can be expressed in terms of a correction factor to be applied to the nominal shear strain (shear displacement divided by the column height). The correction factors are quite sensitive to the column slenderness and the load level. Since correction factors less than unity are possible, one should not interpret the nominal shear strain as the “average” shear strain in the column. Regardless of the load level, the nominal strain underestimates the peak strain by the greatest amount at a slenderness ratio (height/diameter) of 1.7. The nonlinear stiffness results presented in the paper may be used to create more efficient finite element models of entire assemblies by replacing each column with a single nonlinear spring element. When used in conjunction with an appropriate Coffin-Manson relationship, the maximum shear strain results presented herein may be utilized to increase column fatigue life.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAn Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
    typeJournal Paper
    journal volume121
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2793857
    journal fristpage303
    journal lastpage311
    identifier eissn1043-7398
    keywordsSolders
    keywordsShear (Mechanics)
    keywordsStress
    keywordsDeflection
    keywordsStiffness
    keywordsPlastics
    keywordsDeformation
    keywordsDisplacement
    keywordsFatigue life
    keywordsFinite element model
    keywordsShear deformation
    keywordsShearing
    keywordsSprings
    keywordsPoisson ratio AND Circuits
    treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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