Abstract: Wear life analysis methods are set forth for mechanical components subjected to a large number of repeated compound impacts (normal impact coupled with relative sliding). The wear mechanism in ...

Abstract: The determination of stress in a typical module/lead/card system is generally a very complex task. In the present paper a new engineering modeling approach is given, high-lighting simple, ...

Abstract: The concept of the optimal wearpath is helpful in determining the geometrical formation of the wear scar due to repeated contact loading. By definition it is that shape which alleviates the ...

Abstract: The coupling of a square base plate to another reinforcing plate is solved for torsional loads. Nondimensional analysis is carried out using thin plate theory. The distribution of connecting ...

Abstract: A mechanical model is presented for the “time to failure” of a sliding magnetic head-disk interface system. The principal physical variables include the sliding speed, surface topography, elastic ...

Abstract: While primary thermal stress analysis of pin grid arrays considers a nonflexible card and module delineating the structure, in this paper we consider the stress relief (resulting in a “secondary” ...

Abstract: Engineering analysis of module-populated printed circuit cards subjected to torsion is pursued by approximate engineering analysis, numerical (finite element), and experimental means. The engineering ...

Abstract: The elastohydrodynamic lubrication problem of a thin elastic layer pressed between two cylinders which rotate in opposite directions is discussed. The analysis leads to an integro-differential ...