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    Equivalent One-Dimensional System for Analysis of Taper Leaf Springs 

    Source: Journal of Manufacturing Science and Engineering:;1976:;volume( 098 ):;issue: 001:;page 39
    Author(s): N. J. Nigro; S. P. Bhatia
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper an equivalent one-dimensional system for taper leaf springs (similar to those used in vehicle suspension systems) is developed so that results obtained from it are in good agreement ...
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    Non-Newtonian Squeeze Film Between Two Plane Annuli 

    Source: Journal of Tribology:;1982:;volume( 104 ):;issue: 002:;page 275
    Author(s): A. F. Elkouh; N. J. Nigro; Y. S. Liou
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An analysis is presented for the laminar squeezing flow of an incompressible power-law fluid between parallel plane annuli. The results obtained are based on the thin-film approximation, and ...
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    A Generalized Squeezing Flow of a Power-Law Fluid Between Two Plane Annuli 

    Source: Journal of Tribology:;1986:;volume( 108 ):;issue: 001:;page 80
    Author(s): A. F. Elkouh; N. J. Nigro; A. Glowacz
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A generalization of the problem of laminar squeezing flow of a non-Newtonian fluid between plane annular surfaces is presented. The generalization considers the effect of difference in the ...
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    Finite Element Method for Predicting Equilibrium Shapes of Solder Joints 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002:;page 141
    Author(s): N. J. Nigro; S. M. Heinrich; A. F. Elkouh; Ping S. Lee; X. Zou; R. Fournelle
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper discusses the development and application of a finite element method for determining the equilibrium shapes of solder joints which are formed during a surface mount reflow process. ...
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    Solder Joint Formation in Surface Mount Technology—Part I: Analysis 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003:;page 210
    Author(s): S. M. Heinrich; A. F. Elkouh; Ping S. Lee; N. J. Nigro
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An analytical model of solder joint formation during a surface mount reflow process is developed in the present paper, and the solution is obtained in an explicit integral form. For two ...
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    Solder Joint Formation in Surface Mount Technology—Part II: Design 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003:;page 219
    Author(s): S. M. Heinrich; N. J. Nigro; P. S. Lee; A. F. Elkouh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension ...
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    Effect of Chip and Pad Geometry on Solder Joint Formation in SMT 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 004:;page 433
    Author(s): S. M. Heinrich; N. J. Nigro; P. S. Lee; A. F. Elkouh; P. E. Liedtke
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An analytical model of solder joint formation during a surface mount reflow process is developed for two-dimensional fillets whose flow may be restricted due to “finite” metallizations on a ...
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    Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints 

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003:;page 142
    Author(s): N. J. Nigro; F. J. Zhou; S. M. Heinrich; A. F. Elkouh; R. A. Fournelle; P. S. Lee
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper discusses the application of the parametric finite element method for predicting shapes of three-dimensional solder joints. With this method, the surface of the joint is meshed ...
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    Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint 

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 004:;page 268
    Author(s): A. F. Elkouh; P. S. Lee; D. Shangguan; N. Ramasubramanian; T. F. Hsu; N. J. Nigro; S. M. Heinrich
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation ...
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