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    Flexible Profile Compact Thermal Models for Practical Geometries 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003:;page 256
    Author(s): Mohamed-Nabil Sabry
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Recent advances in compact thermal models have led to the emergence of a new concept allowing models to be created at any desired order of accuracy. Traditionally, increasing precision was ...
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    Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design 

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004:;page 344
    Author(s): Mohamed-Nabil Sabry
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Heat transfer in micro-channels, used as an efficient cooling method for electronic circuits, is revisited. Channel walls act as a fin conveying heat to the cooling fluid. The relatively low ...
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    Generalization of the Heat Transfer Coefficient Concept for System Simulation 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 006:;page 60905
    Author(s): Mohamed-Nabil Sabry
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Large progress has been realized in modeling conduction heat transfer problems over the past decade by the introduction of high performance compact thermal models (CTMs) mainly developed for ...
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    Editorial 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004:;page 40201
    Author(s): Bahgat Sammakia; Mohamed-Nabil Sabry
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Mohamed-Nabil Sabry serving as the special guest editor for the issue. The ThETA I executive committee consisted of Bernard Courtois, TIMA Lab., Grenoble, France, Yogendra Joshi, Georgia Inst. Technology, USA, Waturu Nakayama...
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    Editorial 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003:;page 30201
    Author(s): Bahgat Sammakia; Mohamed-Nabil Sabry
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: presented at the conference, and deemed worthy of archival publication in the JEP after the papers were reviewed again by the JEP with Professor Mohamed-Nabil Sabry serving as the special guest editor for the issue. The Th...
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    Thermal Issues in Emerging Technologies 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 006:;page 60301
    Author(s): Yogendra Joshi; Mohamed-Nabil Sabry
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This special issue of the Journal of Heat Transfer contains six papers selected out of the 53 presented at the Second International Conference on Thermal Issues in Emerging Technologies, Theory ...
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    Compact Thermal Models: A Global Approach 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004:;page 41107
    Author(s): Mohamed-Nabil Sabry; Hossam Saleh Abdelmeguid
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The construction and usage of compact thermal models (CTMs), for the thermal analysis as well as the design of cooling devices for electronic systems, are reviewed. These models have many ...
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