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RISTwo Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent trends including rapid increases in the power ratings and continued miniaturization of semiconductor devices have pushed the heat dissipation of power electronics well beyond the range of conventional thermal ...
Modeling Thermal Microspreading Resistance in Via Arrays
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As thermal management techniques for threedimensional (3D) chip stacks and other highpower density electronic packages continue to evolve, interest in the thermal pathways across substrates containing a multitude of ...
Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Transient liquid phase sintering (TLPS) is a novel high-temperature attach technology. It is of particular interest for application as die attach in power electronic systems because of its high-melting temperature and high ...
Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: To improve the reliability and efficiency of power electronics, their thermal management must be further enhanced. Next-generation electronics systems are predicted to dissipate more heat as die size shrinks and power ...
Special Section on InterPACK2021
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It ...