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RISA Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Liquid cooling garments (LCGs) are considered feasible cooling equipment to protect individuals from hyperthermia and heat-related illness when working in extremely hot and stressful environments. So far, the goals for the ...
Quantum Dots Converted Light Emitting Diodes Packaging for Lighting and Display: Status and Perspectives
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent years, semiconductor quantum dots (QDs) have attracted tremendous attentions for their unique characteristics for solidstate lighting (SSL) and thinfilm display applications. The pure and tunable spectra of QDs make ...
Physics-Informed Proper Orthogonal Decomposition for Accurate and Superfast Prediction of Thermal Field
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal field prediction has garnered ever-increasing attention as an urgent and vital issue in broad applications ranging from thermal management, performance prognosis, lifetime evaluation, and safety assessment, to ...
Numerical and Experimental Study on the Transferred Volume in Phosphor Dip Transfer Coating Process of Light Emitting Diodes Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The phosphor diptransfer coating method is simple and flexible for transferring a preanalyzed volume of phosphor gel, which can be beneficial to the high angular color uniformity (ACU) of white lightemitting diodes (LEDs). ...
Special Section on InterPACK 2015
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: InterPACK 2015, the flagship conference of the ASME Electronic and Photonic Packaging Division held on July 6–9, 2015 in San Francisco, CA, is the premier international forum for the exchange of stateoftheart knowledge ...
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ...
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ...
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...