Abstract: The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification ...

Abstract: A previous study by the authors on fin-shape optimization of a plate fin heat sink has concluded that a depopulated central zone, just under the center of the fan, provides a better thermal ...

Abstract: One of the key challenges in the thermal management of electronic packages are interfaces, such as those between the chip and heat spreader and the interface between a heat spreader and heat ...

Abstract: Today’s consumer market demands electronics that are smaller, faster, and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. ...

Abstract: This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages ...