Abstract: The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional ...

Abstract: An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts ...

Abstract: An approximated closed-form integrated circuit (IC) yield formula based on a Gaussian defect density distribution for the compounder in Murphy’s yield integral is presented. Also, a closed-form ...

Abstract: Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the ...

Abstract: A cyclogenesis event that occurred over Colorado in early March of 1981 is the focus of this study. Two features that seemed to play a role in storm initiation were a traveling upper troposphere disturbance associated with ...

Abstract: The author poses a question about what happens to the lateral stress of a normally consolidated clay aging in an oedometer at constant vertical stress. A written and verbal survey of 32 senior engineers from research and ...