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RISClosed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Thermal Stress Analysis of SMT PQFP Packages and Interconnections
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed ...
A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The purpose of this paper is to point out a very common mistake made in determining the thermal stresses in composite structures by finite element methods. Furthermore, a simple technique to ...
Thermoelastic Solutions for a Finite Substrate With an Electronic Device
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Sneddon and Lockett obtained a fairly general solution to the steady-state thermoelastic problem for the thick plate (Sneddon and Lockett, 1960). In particular, they have obtained the exact ...
Elasto-Plastic Large Deflection Analysis of a Copper Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ductility of a copper film has been determined by an elastoplastic large deflection finite element method. The effective stress and incremental plastic strain and pressure-deflection curves ...
Vibration Frequencies of Tapered Bars With End Mass
Publisher: The American Society of Mechanical Engineers (ASME)
Vibration Frequencies and Mode Shapes for a Constrained Cantilever
Publisher: The American Society of Mechanical Engineers (ASME)
Bending and Twisting of Internally Pressurized Thin-Walled Cylinder With Creep
Publisher: The American Society of Mechanical Engineers (ASME)
Structural Analysis of Printed Circuit Board Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Finite Element Modeling for Optimizing Hermetic Package Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal stresses in microwave packages are studied by the finite element method. Emphasis is placed on the effects of material construction and design on the reliability of very small ...