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RISIncorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Accelerated testing has been executed to examine the combined influence of electromigration (EM) stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder ...
Transient Liquid Phase Bond Acceleration Using Copper Nanowires
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Increasing heat flux in power electronics modules is taxing the limits of thermal management technologies. This is the result of wide bandgap semiconductor devices with superior voltage blocking capabilities. These same ...
Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the inherently low adhesive strength and structural integrity of polymer thermal interface materials (TIMs), they present a likely point of failure when succumbed to thermomechanical stresses in electronics packaging. ...
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Convective heat transfer by jet impingement cooling offers a suitable solution for high heat flux applications. Compared to techniques that rely on bulk conduction in series with convection, direct liquid impingement reduces ...
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Passive cooling through phase change materials (PCM) creates beneficial complimentary cooling techniques aimed at providing thermal gradient mitigation during device operation without additional power requirements. These ...
Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal ...
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Miniaturization as well as manufacturing processes that electronics devices are subjected to often results in to increase in operational parameters such as current density, temperature, mechanical load, and with potential ...
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a ...
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional ...
Module-Level Thermal Interface Material Degradation in HALT
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, thermal interface material (TIM) degradation is driven through highly accelerated life test (HALT) using temperature cycling with a prescribed vibrational acceleration for two commercially available materials ...