Abstract: This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder alloys during thermomechanical fatigue. Micromechanical modeling of cyclic deformation of eutectic ...

Abstract: This paper presents an investigation of lead-free Sn-Ag base alloy, 95.5Sn-3.9Ag-0.6Cu, both experimentally and analytically. Experimentally, the deformation behavior of the material was measured ...

Abstract: The effects of specimen geometry size on the behavior of 63Sn-37Pb solder are investigated both experimentally in the laboratory and analytically with finite-element simulations. The simulations ...

Abstract: This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60 Sn-40 Pb solder. Based ...