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RISFatigue Crack Growth Rate in 63Sn37Pb Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fatigue crack growth rate (FCGR) was determined in shear (Mode II) on notched 63Sn37Pb solder joints at room temperature. The FCGR data correlated reasonably well with the expression da/dN = ...
Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effects of time (10-6000 s) and temperature (194°-265°C) on the wetting of a Ag-0.33 wt percent Pt thick film (10 μm) conductor substrate by molten 60Sn40Pb were investigated using ...
Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The deformation kinetics of near-eutectic Pb-Sn alloys in monotonic and cyclic loading in shear at 300K were investigated by determining the stress exponent n in the Dorn equation using several ...
Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-mechanical cycling (– 30°/130°C) tests were performed on 63Sn37Pb solder joints with cycle periods of 12–48 min. The effect of phase (grain) size was incorporated into the ...
Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The plastic deformation kinetics of 95.5Sn4Cu0.5Ag solder joints were determined in monotonic loading shear over the temperature range of 25°–150°C using three types of tests: (a) constant ...
Special Issue on Mechanics of Surface Mount Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)