Abstract: The extended bond graph notion was developed to overcome significant limitations in the standard bond graph notation for modeling systems described by vector and tensor-valued quantities. A brief ...

Abstract: To illustrate the use of the extended bond graph notation, a reticulation is developed for a conjugate variable approximation of the traction problem in linear elastodynamics. This reticulation ...

Abstract: A thermal model of the infrared reflow soldering process is developed and sample predictions are reported. The model, which accounts for coupled radiation, mixed convection and conduction heat ...

Abstract: An experimental study has been conducted to reveal the relevant heat transfer mechanisms which exist within an infrared reflow oven. Simulated card assemblies are used and their transient thermal ...

Abstract: A numerical model is developed that describes the infrared reflow soldering of surface mounted components onto prewired circuit cards. The model predicts convective conditions within the reflow ...

Abstract: Solder joints of leadless surface mounted components, which were thermally cycled, were studied to determine their failure mode and to compare the results with work done on bulk solder specimens. ...