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RISManifold Gas Dynamics Modeling and Its Coupling With Single-Cylinder Engine Models Using Simulink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A flexible model for computing one-dimensional, unsteady manifold gas dynamics in single-cylinder spark-ignition and diesel engines has been developed. The numerical method applies an explicit, ...
Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This special issue includes selected papers presented at the International Conference of Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Paris, May ...
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In microelectronic industry, thin polymer layers are one of the more commonly used product constituents. Examples are glue layers, coatings, and dielectric layers. The thicknesses of these films ...
Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: SiLK is a polymer material developed for use as a thin-film dielectric in the interconnect structure of high-density integrated circuits. Among others, its thermomechanical properties play a ...
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermo-mechanical integration of polymer films requires a precise knowledge of material properties. Nanoindentation is a widely used testing method for the determination of material properties ...
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A complete vapor pressure model based on a micromechanics approach is developed in this paper. The model can be extended to calculate the initial vapor pressure as traction loading subjected ...
Response Surface Modeling for Nonlinear Packaging Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize ...
Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Finite element modeling is widely used for estimating the solder joint reliability of electronic packages. In this study, the electronic package is a CSP mounted on a printed circuit board ...
Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding ...
Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in ...