Abstract: The dynamic response of the printed circuit board (PCB) in a standard board-level drop impact test has been modeled as a spring-mass system, a beam, and a plate. Analytical solutions for the ...

Abstract: A fundamental understanding of the dynamics of the PCB assembly when subjected to a half-sine acceleration has also been obtained through analyzing the PCB as a spring mass system, a beam, ...

Abstract: A reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress ...