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RISA Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fracture of glass seals in metallic hermetic electronic packaging is a significant failure mode because it may lead to moisture ingress and also to loss of load carrying capacity of the glass ...
A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the authors present a stress analysis technique based on a novel nested finite element methodology (NFEM). The NFEM is similar in concept to an earlier proposed multi-domain ...
A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The nested finite element methodology (NFEM) presented in Part I of this series, is used in this paper to analyze the viscoplastic stress-state in a flip-chip-on-board (FCOB) and a chip scale ...
Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void ...
Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper illustrates the micromechanics approach to cyclic creep-fatigue damage of Pb-Sn, developed by the authors with the help of a simple case study. It is demonstrated that durability ...
Large‐Scale Model Test on Square Box Culvert Backfilled with Sand
Publisher: American Society of Civil Engineers
Abstract: A comparison is made of the experimental and theoretical values of bending moment, shear force, deflection, and pressure for a reinforced concrete box culvert measuring 1,200 by 1,200 mm (inside dimensions) by 9-m long and ...
Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study examines damage initiation and propagation in solder joints with voids, under thermomechanical cyclic loading. An accelerated thermal cycling test is conducted on printed wiring assemblies ...
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of process-induced voids on the durability of Sn–Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ...
A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wire bond connections are susceptible to fatigue failure as a result of various thermo-mechanical damage mechanisms during the component operation life. Because of uncertainties arising from the ...
Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study is motivated by the urgent need in the electronics industry for mechanical properties and durability of Pb-free solders because the use of Pb will be banned in the EU by July 1, ...