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    Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal Loads 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004:;page 355
    Author(s): A. O. Cifuentes
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The problem of determining the stresses in a bimaterial beam subjected to a thermal load is considered. One beam layer is assumed to be linear while the second layer is assumed to be ...
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    A Note on the Determination of the Thermal Stresses in Multi-Metal Beams Subjected to Temperature Variations 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004:;page 425
    Author(s): A. O. Cifuentes
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This technical note shows that the determination of the stresses induced in multi-metal beams by temperature changes reduces to solving a linear system of equations. This system of equations ...
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    A Global Sensitivity Approach for the Dynamic Response of Printed Wiring Boards 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001:;page 7
    Author(s): H. Jensen; A. O. Cifuentes
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper is concerned with the sensitivity of the dynamic response of printed wiring boards (PWB). A general method to study the sensitivity of the response of the board as a function of ...
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    Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004:;page 397
    Author(s): A. O. Cifuentes; S. R. Stiffler
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Periodic structures, that is, structures that consist of a basic pattern which is repeated multiple times, are commonplace in the electronics industry. This paper is concerned with the determination ...
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    A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 391
    Author(s): H. A. Jensen; A. O. Cifuentes
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This technical note presents a global sensitivity analysis method for the dynamic response of electronic systems considering several design parameters at the same time. The method is an extension ...
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