Scalable Au Metal-Assisted Chemical Etch Nanopatterning Using Enhanced Metal Break Techniques

Abstract

This paper presents catalyst patterning techniques for promoting wafer-scale uniformity while producing taper-free high aspect ratio Si nanostructures using gold (Au) metal-assisted chemical etch (MacEtch). Typical Au nanopatterning involves the use of liftoff processes which have poor yield in manufacturing settings. We report a technique that takes advantage of adhesive forces during MacEtch to mechanically break the metal catalyst over a patterned resist. Three methods for generating increased uniformity are demonstrated—(i), (ii), (iii). Using these methods, taper-free 100 nm nanopillars are presented with wafer-scale uniformity using techniques that can be readily implemented for scalable nanomanufacturing.