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contributor authorY. Weitsman
date accessioned2017-05-08T23:06:00Z
date available2017-05-08T23:06:00Z
date copyrightSeptember, 1979
date issued1979
identifier issn0021-8936
identifier otherJAMCAV-26125#563_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/91727
description abstractThis paper concerns the residual thermal stresses that develop within the resin of a fiber-reinforced composite-laminate as the material is cooled from cure temperature down to room temperature. The calculations presented herein consider the viscoelastic response of the resin and account for the temperature dependence and the stress sensivitity of the creep compliance. Comparisons with linear elasticity indicate that viscoelastic relaxation may reduce the residual stresses by about 20 percent.
publisherThe American Society of Mechanical Engineers (ASME)
titleResidual Thermal Stresses Due to Cool-Down of Epoxy-Resin Composites
typeJournal Paper
journal volume46
journal issue3
journal titleJournal of Applied Mechanics
identifier doi10.1115/1.3424606
journal fristpage563
journal lastpage567
identifier eissn1528-9036
keywordsComposite materials
keywordsEpoxy resins
keywordsThermal stresses
keywordsTemperature
keywordsResins
keywordsElasticity
keywordsCreep
keywordsFibers
keywordsLaminates
keywordsResidual stresses
keywordsRelaxation (Physics) AND Stress
treeJournal of Applied Mechanics:;1979:;volume( 046 ):;issue: 003
contenttypeFulltext


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