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    Thermal Stresses From a Moving Band Source of Heat on the Surface of a Semi-Infinite Solid

    Source: Journal of Manufacturing Science and Engineering:;1978:;volume( 100 ):;issue: 001::page 43
    Author:
    R. J. Mercier
    ,
    S. Malkin
    ,
    J. C. Mollendorf
    DOI: 10.1115/1.3439344
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermoelastic stresses arising from a moving band source of heat on the surface of a semi-infinite solid have been calculated using well-known temperature solutions and a finite element stress analysis. Results are presented in nondimensional form for a wide range of conditions for both quasi-steady state and transient regimes. The effect of convective cooling at the surface has also been investigated. Peak stresses, which occur at the surface, have been related to a modified source Peclet number for instances in which surface cooling is not employed. Reduction in stress levels due to convective cooling at the surface has also been determined. For all cases considered, the greatest stress levels were found to occur at the surface of the constrained direction. Using results obtained in this study, thermoelastic stresses in sliding and machining processes may be calculated in order to predict the onset of yielding which can result in residual tensile stresses and cracking.
    keyword(s): Heat , Thermal stresses , Stress , Cooling , Machining , Temperature , Stress analysis (Engineering) , Finite element analysis , Fracture (Process) AND Tension ,
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      Thermal Stresses From a Moving Band Source of Heat on the Surface of a Semi-Infinite Solid

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/91318
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    • Journal of Manufacturing Science and Engineering

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    contributor authorR. J. Mercier
    contributor authorS. Malkin
    contributor authorJ. C. Mollendorf
    date accessioned2017-05-08T23:05:16Z
    date available2017-05-08T23:05:16Z
    date copyrightFebruary, 1978
    date issued1978
    identifier issn1087-1357
    identifier otherJMSEFK-27669#43_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/91318
    description abstractThermoelastic stresses arising from a moving band source of heat on the surface of a semi-infinite solid have been calculated using well-known temperature solutions and a finite element stress analysis. Results are presented in nondimensional form for a wide range of conditions for both quasi-steady state and transient regimes. The effect of convective cooling at the surface has also been investigated. Peak stresses, which occur at the surface, have been related to a modified source Peclet number for instances in which surface cooling is not employed. Reduction in stress levels due to convective cooling at the surface has also been determined. For all cases considered, the greatest stress levels were found to occur at the surface of the constrained direction. Using results obtained in this study, thermoelastic stresses in sliding and machining processes may be calculated in order to predict the onset of yielding which can result in residual tensile stresses and cracking.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Stresses From a Moving Band Source of Heat on the Surface of a Semi-Infinite Solid
    typeJournal Paper
    journal volume100
    journal issue1
    journal titleJournal of Manufacturing Science and Engineering
    identifier doi10.1115/1.3439344
    journal fristpage43
    journal lastpage48
    identifier eissn1528-8935
    keywordsHeat
    keywordsThermal stresses
    keywordsStress
    keywordsCooling
    keywordsMachining
    keywordsTemperature
    keywordsStress analysis (Engineering)
    keywordsFinite element analysis
    keywordsFracture (Process) AND Tension
    treeJournal of Manufacturing Science and Engineering:;1978:;volume( 100 ):;issue: 001
    contenttypeFulltext
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