Simplified Impedance Model for Adhesively Bonded Piezo-Impedance Transducers

Abstract

The electromechanical impedance technique employs surface-bonded lead zirconate titanate piezoelectric ceramic patches as impedance transducers for structural health monitoring and nondestructive evaluation. The patches are bonded to the monitored structures using finitely thick adhesive bond layer, which introduces shear lag effect, thus invariably influencing the electromechanical admittance signatures. This paper presents a new simplified impedance model to incorporate shear lag effect into electromechanical admittance formulations, both one-dimensional and two-dimensional. This provides a closed-form analytical solution of the inverse problem, i.e. to derive the true structural impedance from the measured conductance and susceptance signatures, thus an improvement over the existing models. The influence of various parameters (associated with the bond layer) on admittance signatures is investigated using the proposed model and the results compared with existing models. The results show that the new model, which is far simpler than the existing models, models the shear lag phenomenon reasonably well besides providing direct solution of a complex inverse problem.