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contributor authorPachpande, Nishit
contributor authorAmbalgi, Pushkaraj
contributor authorBapat, Ganesh M.
date accessioned2025-08-20T09:39:23Z
date available2025-08-20T09:39:23Z
date copyright4/21/2025 12:00:00 AM
date issued2025
identifier issn1948-5085
identifier othertsea-24-1527.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4308633
description abstractOrthotic walker boots, commonly used for lower limb injuries, have been linked to discomfort due to increased skin temperatures, which can result in excessive sweating and skin problems. This research investigates the boot–skin temperature variation at the posterior and anterior sections of the leg after wearing an orthotic boot for an extended period. The temperature distribution at the orthotic boot–skin interface was studied using experimental measurements and finite element simulations. The temperature data were collected from eight male participants using 12 thermistors judiciously placed around the shank. The participants wore an orthotic boot for 60 min while sitting idle, and the temperature rises in the anterior and posterior regions of the leg were recorded. An average temperature rise of 2.3 °C ± 0.7 °C in the anterior region and 2.5 °C ± 0.6 °C in the posterior region was observed. These findings corroborate with the finite element simulations, which demonstrated similar temperature rise of 2.2 °C ± 0.4 °C and 2.4 °C ± 0.5 °C in the anterior and posterior regions, respectively. A statistical analysis using the seven-point Bedford scale for thermal sensation showed that the temperature rise in the posterior region was statistically significant (p = 0.022), with a higher increase noted in the posterior region compared to the anterior. The finite element simulations presented here can be used as an optimization tool to study the use of new materials and design modifications to reduce thermal discomfort in orthotic devices and exoskeletons.
publisherThe American Society of Mechanical Engineers (ASME)
titleExperimental and Finite Element Investigations to Study the Temperature Distribution at the Orthotic Boot–Skin Interface
typeJournal Paper
journal volume17
journal issue7
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4068365
journal fristpage71008-1
journal lastpage71008-9
page9
treeJournal of Thermal Science and Engineering Applications:;2025:;volume( 017 ):;issue: 007
contenttypeFulltext


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