Numerical Study on Transient Flow Boiling Performance of the Microchannels With Grooved Pin Fins

Abstract

The microchannel flow boiling cooling technology has excellent developmental potential in high heat flux electronic devices. Saturated flow boiling in a microchannel with V-shaped grooved pin fins is simulated using the volume of fluid (VOF) model. The working coolant is Novec649. The depth-to-width ratio β of a single groove is set as 0, 1, and 2, respectively. The results show that with the increase of β, the maximal average temperature of heated walls decreases, and at q = 100, 300, and 500 kW·m−2, the average temperature at β = 2 declined 1.5, 5.3, and 9.3 K, respectively, compared with that at β = 0. The corresponding pressure drops are decreased by 24%, 25%, and 24%, respectively. The corresponding heat transfer factor remarkably increases 14–40%. Moreover, the model with β = 1 has the superior heat transfer coefficient while the model with β = 2 has the best comprehensive heat transfer factor as a whole.