YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • ASME Journal of Heat and Mass Transfer
    • View Item
    •   YE&T Library
    • ASME
    • ASME Journal of Heat and Mass Transfer
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    A Model on Bubble Dynamics in Liquid Film Boiling

    Source: ASME Journal of Heat and Mass Transfer:;2025:;volume( 147 ):;issue: 006::page 61601-1
    Author:
    Zou, Qifan
    ,
    Li, Pengkun
    ,
    Liu, Xiuliang
    ,
    Yang, Ronggui
    DOI: 10.1115/1.4067475
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Liquid film boiling, where bubbles are generated together with evaporation in several hundred micrometers thick liquid film, has attracted great interest recently due to its potential in dissipating high heat flux with low superheat. However, the existing models on bubble dynamics based on pool boiling are not suitable for predicting the bubble behaviors in liquid film boiling. Here, we develop a theoretical model to study bubble dynamics (including nucleation, growth, and departure) in liquid film boiling on the horizontal surface. By considering the evaporation atop the liquid film surface, we solve the transient heat conduction in the liquid film, and then derive the waiting period for bubble nucleation. The bubble growth rate is computed by taking into account evaporation from both superheated liquid layer and microlayer. Bubble departure diameter is obtained by considering the surface tension force atop the liquid film and reconstructing the pendant bubble shape based on the Young-Laplace equation. It is shown that when liquid film thickness reduces, the bubble waiting period increases, while the bubble growth period and growth rate decrease. By predicting the heat transfer based on bubble dynamics, we find that the enhanced heat transfer in liquid film boiling, compared to pool boiling, mainly benefits from the significantly increased bubble departure frequency due to reduced departure diameter.
    • Download: (2.956Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      A Model on Bubble Dynamics in Liquid Film Boiling

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4305706
    Collections
    • ASME Journal of Heat and Mass Transfer

    Show full item record

    contributor authorZou, Qifan
    contributor authorLi, Pengkun
    contributor authorLiu, Xiuliang
    contributor authorYang, Ronggui
    date accessioned2025-04-21T10:12:18Z
    date available2025-04-21T10:12:18Z
    date copyright2/14/2025 12:00:00 AM
    date issued2025
    identifier issn2832-8450
    identifier otherht-24-1283.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4305706
    description abstractLiquid film boiling, where bubbles are generated together with evaporation in several hundred micrometers thick liquid film, has attracted great interest recently due to its potential in dissipating high heat flux with low superheat. However, the existing models on bubble dynamics based on pool boiling are not suitable for predicting the bubble behaviors in liquid film boiling. Here, we develop a theoretical model to study bubble dynamics (including nucleation, growth, and departure) in liquid film boiling on the horizontal surface. By considering the evaporation atop the liquid film surface, we solve the transient heat conduction in the liquid film, and then derive the waiting period for bubble nucleation. The bubble growth rate is computed by taking into account evaporation from both superheated liquid layer and microlayer. Bubble departure diameter is obtained by considering the surface tension force atop the liquid film and reconstructing the pendant bubble shape based on the Young-Laplace equation. It is shown that when liquid film thickness reduces, the bubble waiting period increases, while the bubble growth period and growth rate decrease. By predicting the heat transfer based on bubble dynamics, we find that the enhanced heat transfer in liquid film boiling, compared to pool boiling, mainly benefits from the significantly increased bubble departure frequency due to reduced departure diameter.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Model on Bubble Dynamics in Liquid Film Boiling
    typeJournal Paper
    journal volume147
    journal issue6
    journal titleASME Journal of Heat and Mass Transfer
    identifier doi10.1115/1.4067475
    journal fristpage61601-1
    journal lastpage61601-60
    page60
    treeASME Journal of Heat and Mass Transfer:;2025:;volume( 147 ):;issue: 006
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian