Semi-Analytical Solution for a Single-Phase Thermal Conduction Problem of a Hollow-Cylinder With a Growing or Receding Inner Radius

Abstract

A semi-analytical solution for the thermal conduction of a single phase, homogeneous, circular, hollow-cylinder with a growing or receding inner radius at a constant rate under unit-loading was derived using conformal mapping, Laplace transformation, and a Zakian series representation of the inverse Laplace transform. All solutions allow for convection on the fixed outer radius. Predictions were compared to finite element simulations with excellent agreement observed. Given the changing thickness, thermal transients could not reach true steady-state equilibrium, especially for faster growth or recession rates. Indeed, the temperature states become somewhat linear with respect to time, reflecting the constant velocity of growth or recession. In practice, the resulting solutions can be used to determine temperatures during machining, wear, erosion, corrosion, and/or additive manufacturing, especially for lower temperature solid-state methods such as cold-spray.