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    Effects of Elastoplasticity, Damage, and Environmental Exposure on the Behavior of Adhesive Step-Lap Joints

    Source: Journal of Computing and Information Science in Engineering:;2022:;volume( 023 ):;issue: 003::page 30904-1
    Author:
    Michopoulos, John G.
    ,
    Apetre, Nicole A.
    ,
    Iliopoulos, Athanasios P.
    ,
    Steuben, John C.
    DOI: 10.1115/1.4056361
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The presence of damage in the adhesive material as well as combined environmental excitation in multi-material adhesive step-lap joints (ASLJs) often encountered in aircraft industries are frequently neglected. Historically, the ASLJ design is based only within the scope of elastoplastic failure. The present work describes the implementation and application of a computational framework enabling the quasistatic performance evaluation of such joints under the simultaneous presence of plasticity, damage, and hygrothermal environmental stimuli. In particular, ASLJ linking Ti–6Al–4V alloy adherents with an FM-300K adhesive are modeled under the proposed framework for various material responses and environmental excitations. It is shown that the assumption of using only elastoplastic failure for the adhesive may not be an adequate assumption for designing and qualifying ASLJs. Specifically, consideration of the presence of plasticity, damage, and environmental effects indicates that there are reasons to re-examine the design practices of such joints and to determine the relevant material constants associated with the multiphysics cross-coupling effects.
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      Effects of Elastoplasticity, Damage, and Environmental Exposure on the Behavior of Adhesive Step-Lap Joints

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4294462
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    contributor authorMichopoulos, John G.
    contributor authorApetre, Nicole A.
    contributor authorIliopoulos, Athanasios P.
    contributor authorSteuben, John C.
    date accessioned2023-11-29T18:55:06Z
    date available2023-11-29T18:55:06Z
    date copyright12/21/2022 12:00:00 AM
    date issued12/21/2022 12:00:00 AM
    date issued2022-12-21
    identifier issn1530-9827
    identifier otherjcise_23_3_030904.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4294462
    description abstractThe presence of damage in the adhesive material as well as combined environmental excitation in multi-material adhesive step-lap joints (ASLJs) often encountered in aircraft industries are frequently neglected. Historically, the ASLJ design is based only within the scope of elastoplastic failure. The present work describes the implementation and application of a computational framework enabling the quasistatic performance evaluation of such joints under the simultaneous presence of plasticity, damage, and hygrothermal environmental stimuli. In particular, ASLJ linking Ti–6Al–4V alloy adherents with an FM-300K adhesive are modeled under the proposed framework for various material responses and environmental excitations. It is shown that the assumption of using only elastoplastic failure for the adhesive may not be an adequate assumption for designing and qualifying ASLJs. Specifically, consideration of the presence of plasticity, damage, and environmental effects indicates that there are reasons to re-examine the design practices of such joints and to determine the relevant material constants associated with the multiphysics cross-coupling effects.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffects of Elastoplasticity, Damage, and Environmental Exposure on the Behavior of Adhesive Step-Lap Joints
    typeJournal Paper
    journal volume23
    journal issue3
    journal titleJournal of Computing and Information Science in Engineering
    identifier doi10.1115/1.4056361
    journal fristpage30904-1
    journal lastpage30904-12
    page12
    treeJournal of Computing and Information Science in Engineering:;2022:;volume( 023 ):;issue: 003
    contenttypeFulltext
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    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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