contributor author | Michopoulos, John G.;Apetre, Nicole A.;Iliopoulos, Athanasios P.;Steuben, John C. | |
date accessioned | 2023-04-06T12:53:21Z | |
date available | 2023-04-06T12:53:21Z | |
date copyright | 12/21/2022 12:00:00 AM | |
date issued | 2022 | |
identifier issn | 15309827 | |
identifier other | jcise_23_3_030904.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4288707 | |
description abstract | The presence of damage in the adhesive material as well as combined environmental excitation in multimaterial adhesive steplap joints (ASLJs) often encountered in aircraft industries are frequently neglected. Historically, the ASLJ design is based only within the scope of elastoplastic failure. The present work describes the implementation and application of a computational framework enabling the quasistatic performance evaluation of such joints under the simultaneous presence of plasticity, damage, and hygrothermal environmental stimuli. In particular, ASLJ linking Ti–6Al–4V alloy adherents with an FM300K adhesive are modeled under the proposed framework for various material responses and environmental excitations. It is shown that the assumption of using only elastoplastic failure for the adhesive may not be an adequate assumption for designing and qualifying ASLJs. Specifically, consideration of the presence of plasticity, damage, and environmental effects indicates that there are reasons to reexamine the design practices of such joints and to determine the relevant material constants associated with the multiphysics crosscoupling effects. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Effects of Elastoplasticity, Damage, and Environmental Exposure on the Behavior of Adhesive StepLap Joints | |
type | Journal Paper | |
journal volume | 23 | |
journal issue | 3 | |
journal title | Journal of Computing and Information Science in Engineering | |
identifier doi | 10.1115/1.4056361 | |
journal fristpage | 30904 | |
journal lastpage | 3090412 | |
page | 12 | |
tree | Journal of Computing and Information Science in Engineering:;2022:;volume( 023 ):;issue: 003 | |
contenttype | Fulltext | |