| contributor author | He, Gong;Tongyang, Wang;Jianqun, Zhu;Shujin, Li;Yao, Yao | |
| date accessioned | 2023-04-06T12:51:52Z | |
| date available | 2023-04-06T12:51:52Z | |
| date copyright | 12/2/2022 12:00:00 AM | |
| date issued | 2022 | |
| identifier issn | 218936 | |
| identifier other | jam_90_3_031004.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4288648 | |
| description abstract | Aiming at the potential hightemperature packaging material of the wide band gap semiconductors, experimental and theoretical analysis on the compressive properties of sintered nanosilver was performed. The viscoplastic properties of sintered nanosilver were investigated by compressive experiments with five loading rates, and the effects of loading rate on the ultimate strength and elastic modulus of sintered nanosilver were analyzed. According to the microstructure characteristics of sintered nanosilver, the damage framework including void volume fraction was developed by extending the Gurson–Tvergaard–Needleman model, and the mathematical model between Bonora damage law and void volume fraction was proposed, in which the internal void was assumed to be sphere and cube. A modified constitutive model including the damage model was developed based on the unified creep and plasticity theory for describing the compressive properties of sintered nanosilver. The accuracy of the proposed model was verified by comparing it with the experimental data. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Compressive Experimental Analysis and Constitutive Model of Sintered NanoSilver | |
| type | Journal Paper | |
| journal volume | 90 | |
| journal issue | 3 | |
| journal title | Journal of Applied Mechanics | |
| identifier doi | 10.1115/1.4056253 | |
| journal fristpage | 31004 | |
| journal lastpage | 3100412 | |
| page | 12 | |
| tree | Journal of Applied Mechanics:;2022:;volume( 090 ):;issue: 003 | |
| contenttype | Fulltext | |
