A Unified Analogy-Based Computation Methodology From Elasticity to Electromagnetic-Chemical-Thermal Fields and a Concept of Multifield SensingSource: ASME Open Journal of Engineering:;2022:;volume( 001 )::page 11008-1DOI: 10.1115/1.4053910Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports a unified analogy-based computation methodology, together with a concept of multifield, multifunctional sensing, from elasticity to electromagnetic-chemical-thermal fields, via utilizing the similarities of mechanical-electromagnetic-chemical-thermal (MEMCT) field variables, governing equations, and the material properties pertaining to each individual field. Two equivalences are systemized, which are the field-formulation equivalence and surface-value equivalence. Due to similarity, a number of thermal, electromagnetic, or chemical solutions can be obtained from the direct degeneration of existing mechanical solutions by making specified equivalences of 2G↔k0↔ϖ0↔μ0↔β0 with G for shear modulus, k0 for heat conductivity, ϖ0 for dielectric permittivity, μ0 for magnetic permeability, and β0 for chemical diffusivity, as well as by setting Poisson’s ratio ν → 0.5. These specified equivalences enable quick solutions to other fields directly from mechanics formulations, such as those in the forms of the Galerkin vectors and Papkovich-Neuber potentials, and field coupling, by means of analogy. Several examples are given, one is used to demonstrate that the field solutions of a layered half-space with imperfect thermal, electromagnetic, or chemical interfaces can be readily obtained from the elastic solutions involving interfacial imperfections via the obtained formulation equivalence. A set of simple equations are derived to relate surface behaviors of different fields via the obtained surface-value equivalence, on which a concept of multifield sensing is proposed.
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contributor author | Zhang, Xin | |
contributor author | Wang, Q. Jane | |
date accessioned | 2022-05-08T09:03:41Z | |
date available | 2022-05-08T09:03:41Z | |
date copyright | 3/4/2022 12:00:00 AM | |
date issued | 2022 | |
identifier issn | 2770-3495 | |
identifier other | aoje_1_011008.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4284686 | |
description abstract | This paper reports a unified analogy-based computation methodology, together with a concept of multifield, multifunctional sensing, from elasticity to electromagnetic-chemical-thermal fields, via utilizing the similarities of mechanical-electromagnetic-chemical-thermal (MEMCT) field variables, governing equations, and the material properties pertaining to each individual field. Two equivalences are systemized, which are the field-formulation equivalence and surface-value equivalence. Due to similarity, a number of thermal, electromagnetic, or chemical solutions can be obtained from the direct degeneration of existing mechanical solutions by making specified equivalences of 2G↔k0↔ϖ0↔μ0↔β0 with G for shear modulus, k0 for heat conductivity, ϖ0 for dielectric permittivity, μ0 for magnetic permeability, and β0 for chemical diffusivity, as well as by setting Poisson’s ratio ν → 0.5. These specified equivalences enable quick solutions to other fields directly from mechanics formulations, such as those in the forms of the Galerkin vectors and Papkovich-Neuber potentials, and field coupling, by means of analogy. Several examples are given, one is used to demonstrate that the field solutions of a layered half-space with imperfect thermal, electromagnetic, or chemical interfaces can be readily obtained from the elastic solutions involving interfacial imperfections via the obtained formulation equivalence. A set of simple equations are derived to relate surface behaviors of different fields via the obtained surface-value equivalence, on which a concept of multifield sensing is proposed. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Unified Analogy-Based Computation Methodology From Elasticity to Electromagnetic-Chemical-Thermal Fields and a Concept of Multifield Sensing | |
type | Journal Paper | |
journal volume | 1 | |
journal title | ASME Open Journal of Engineering | |
identifier doi | 10.1115/1.4053910 | |
journal fristpage | 11008-1 | |
journal lastpage | 11008-12 | |
page | 12 | |
tree | ASME Open Journal of Engineering:;2022:;volume( 001 ) | |
contenttype | Fulltext |