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contributor authorXu, Guangming
contributor authorXie, Rongjian
contributor authorLi, Nanxi
contributor authorLiu, Cheng
date accessioned2022-05-08T08:49:23Z
date available2022-05-08T08:49:23Z
date copyright11/18/2021 12:00:00 AM
date issued2021
identifier issn1948-5085
identifier othertsea_14_4_041014.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4284386
description abstractTwo kinds of new refrigerant R1234ze(E) and R245fa were discussed as substitutes or supplements to traditional working fluids of loop heat pipes (LHPs) based on their favorable thermophysical properties and characteristics such as being safe and environmentally friendly. Thermal characteristics of a loop heat pipe with sintering copper wick at different charging ratios were experimentally investigated under variable heat loads. The results showed that the optimal charging ratio in the loop heat pipe range from 65% to 70%, and at this charging level, the R1234ze(E) system had better start-up response, while the R245fa system presented a stronger heat transfer capacity. The characteristic temperature of R1234ze(E) system was below 35 °C, and the corresponding thermal resistance was 0.08 K/W–1.62 K/W under heat loads ranging from 5 W to 40 W. The thermal resistance of the R245fa system was 0.18 K/W–0.91 K/W under heat loads of 10 W–60 W, and the operating temperature was below 60 °C. The loop heat pipes charged with the proposed new refrigerants exhibit superb performance in room temperature applications, making them beneficial for enhancing the performance of electronics and could provide a distinctive choice for the cooling of small-sized electronics especially.
publisherThe American Society of Mechanical Engineers (ASME)
titleExperimental Investigation of a Loop Heat Pipe With R245fa and R1234ze(E) as Working Fluids
typeJournal Paper
journal volume14
journal issue4
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4052596
journal fristpage41014-1
journal lastpage41014-9
page9
treeJournal of Thermal Science and Engineering Applications:;2021:;volume( 014 ):;issue: 004
contenttypeFulltext


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