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    Extended TTS Model for Thermal and Mechanical Creep of Clay and Sand

    Source: Journal of Geotechnical and Geoenvironmental Engineering:;2022:;Volume ( 148 ):;issue: 006::page 04022044
    Author:
    Naifeng Zhao
    ,
    Xiaohui Cheng
    ,
    Andrew J. Whittle
    DOI: 10.1061/(ASCE)GT.1943-5606.0002798
    Publisher: ASCE
    Abstract: In geothermal engineering, the long-term thermomechanical responses of sand and clay are difficult to predict due to the lack of an essential understanding of thermally induced volume change. Recent experimental studies have measured thermal creep of dry sand, glass beads, and clays. However, this universal phenomena of thermal creep has not been properly included in constitutive models of soils. In this paper, the Tsinghua ThermoSoil (TTS) model, previously developed for clay, is extended to describe thermal and mechanical creep of sand. The elemental thermal creep and thermal cyclic behavior of Todi clay and Bangkok sand, reported under hydrostatic stress or oedometric conditions, are reproduced by the proposed formulation. These comparisons show the following key features of behavior described by the extended model (e-TTS): (1) thermal creep of clay can produce either compressive or s1welling behavior depending on the consolidation stress history, (2) the heating rate and temperature range have significant influences on thermal creep, but only small effects on swelling behavior, (3) thermal cycling induces compression of sand, which is dependent on effective stress level and relative density, and (4) the e-TTS model predicts stabilization of thermal creep strains for sands over within 50–100 thermal cycles due to equalization of elastic and locked-in hysteretic strains.
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      Extended TTS Model for Thermal and Mechanical Creep of Clay and Sand

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4283628
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    • Journal of Geotechnical and Geoenvironmental Engineering

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    contributor authorNaifeng Zhao
    contributor authorXiaohui Cheng
    contributor authorAndrew J. Whittle
    date accessioned2022-05-07T21:21:26Z
    date available2022-05-07T21:21:26Z
    date issued2022-04-13
    identifier other(ASCE)GT.1943-5606.0002798.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4283628
    description abstractIn geothermal engineering, the long-term thermomechanical responses of sand and clay are difficult to predict due to the lack of an essential understanding of thermally induced volume change. Recent experimental studies have measured thermal creep of dry sand, glass beads, and clays. However, this universal phenomena of thermal creep has not been properly included in constitutive models of soils. In this paper, the Tsinghua ThermoSoil (TTS) model, previously developed for clay, is extended to describe thermal and mechanical creep of sand. The elemental thermal creep and thermal cyclic behavior of Todi clay and Bangkok sand, reported under hydrostatic stress or oedometric conditions, are reproduced by the proposed formulation. These comparisons show the following key features of behavior described by the extended model (e-TTS): (1) thermal creep of clay can produce either compressive or s1welling behavior depending on the consolidation stress history, (2) the heating rate and temperature range have significant influences on thermal creep, but only small effects on swelling behavior, (3) thermal cycling induces compression of sand, which is dependent on effective stress level and relative density, and (4) the e-TTS model predicts stabilization of thermal creep strains for sands over within 50–100 thermal cycles due to equalization of elastic and locked-in hysteretic strains.
    publisherASCE
    titleExtended TTS Model for Thermal and Mechanical Creep of Clay and Sand
    typeJournal Paper
    journal volume148
    journal issue6
    journal titleJournal of Geotechnical and Geoenvironmental Engineering
    identifier doi10.1061/(ASCE)GT.1943-5606.0002798
    journal fristpage04022044
    journal lastpage04022044-11
    page11
    treeJournal of Geotechnical and Geoenvironmental Engineering:;2022:;Volume ( 148 ):;issue: 006
    contenttypeFulltext
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